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High Performance for COM Express® Pin-out Type 2

• Up to Intel® Core™2 Duo with 45nm
  
• New Intel® GS45/GM45/GL40 and ICH9M
  
• DDR3 SO-DIMM up to 8 GB, dual channel
  
• 4x Serial ATA with RAID, DirectX® 10
  
• And more...

The COMe-bPC2 module unifies the 45 nm generations of Intel® Core™ 2 Duo processors with the new SSE4 instruction set and the chipset Intel® GS45, GM45 and GL40. This combination really sets new standards in many terms: more performance than ever on COM Express® form factor, outstanding performance-power-ratio, fast DDR3 SO-DIMM memory up to 8 GB and L2 cache up to 6 MB, the module really opens up new application fields.

COMe-bPC2 is available with Intel® small form factor package: for instance, the ICH9M was shrunk from 961 mm² to 256 mm². Thus, valuable space for further features is gained: among others two stacked SO-DIMM sockets for dual channel memory. On top of that, Intel® small form factor package processors allow operations in ultra low voltage for best energy-efficiency. The bigger Intel® Performance Package offer high performance for bargain pricing.

Especially, its 4 Serial ATA ports and the native RAID support establishes the COMe-bPC2 perfectly for heavy data sensitive applications. On top of all that, DirectX® 10 supports Windows® perfectly.

Like all KontronCOM Express® modules, it is strictly compliant to the COM Express® standard. Therefore, upgrading existing carrier boards gets so easy and minimizes redesign efforts.